Journal articles

• "Recent Advances in Nanostructured Copper: From Fabrication to Applications", Crystal Growth & Design, 26, 4374–4410, 2026/05, SCI
• "Mechanistic insights into direction-modulated electromigration failures and intermetallic formation in symmetric/asymmetric SnAg solder microbumps", Intermetallics, 190, 109160, 2026/01, SCI