"A Novel Approach to Service Design within the Tourism Industry: Creating a Travel Package with AHP-TRIZ Integration", Systems, 11, 4, 178, 2023/03, SCI
"An optimized method for solving membership-based neutrosophic linear programming problems.", Studies in Informatics and Control, 31, 4, 45-52, 2023/01, SCI
"An optimized model for neutrosophic multi-choice goal programming", Miskolc Mathematical Notes, 24, 2, 915-931, 2023/01, SCI
"A Novel CSAHP Approach to Assess the Priority of Maintenance Work Outsourced by a Metro Company", Processes, 11, 1, 100, 2023/01, SCI
"5G Digital Twin: A Study of Enabling Technologies", Applied Sciences, 12, 15, 7794, 2022/08, SCI
"A Lean Manufacturing Progress Model and Implementation for SMEs in the Metal Products Industry", Processes, 10, 5, 835, 2022/04, SCI
"Applying Deep Learning to Construct a Defect Detection System for Ceramic Substrates", Applied Sciences, 12, 5, 2269, 2022/02, SCI
"Applying Taguchi Method to Optimize Vacuum Printing Encapsulation Process", IEEE Transactions on Components, Packaging and Manufacturing Technology, 12, 1, 185-191, 2022/01, SCI
"Evaluating the Sustainable Operating Performance of Electronics Industry Groups: Taiwanese Firms in Mainland China", Sustainability, 13, 21, 2021/11, SCI
"Improving the electromagnetic compatibility of electronic products by using response surface methodology and artificial neural network", Microelectronics International, 2021/09, SCI
"Design criteria for pad and stencil with high pick-and-Place yield", Soldering & Surface Mount Technology, 2021/09, SCI
"A Practice of BLE RSSI Measurement for Indoor Positioning", Sensors, 21, 15, 2021/07, ELSE2
"Parameter Optimization of Pretin Printing Process of Wireless Communication Module", IEEE Transactions on Components, Packaging and Manufacturing Technology, 11, 7, 1137-1147, 2021/07, SCI
"A machine learning-based framework for exchange rate analysis and prediction", International Journal of Research Publications, 74, 1, 2021/04, ELSE2
"Application of multi-quality parameter design in the optimization of underfilling process", Soldering & Surface Mount Technology, DOI: 10.1108/SSMT-05, DOI: 10.1108/SSMT-05, DOI: 10.1108/SSMT-05, 2020/09, SCI
"Failed Component Image Acquisition Quality Optimization For Machine Vision System", Journal of Current Trends in Signal Processing, 10, 2, 17-25, 2020/01, ELSE2
"Intelligent parametric design for a multiple-quality-characteristic glue-dispensing process", Journal of Intelligent Manufacturing, 30, 5, 2291-2305, 2019/06, SCI
"A digital image processing model for characteristics capture and analysis of irregular electronic components", The International Journal of Advanced Manufacturing Technology, 102, 9-12, 4309-4318, 2019/06, SCI
"Using Parametric Design to Reduce the EMI of Electronics Products — Example of Medical-Grade Touch Panel Computer", Progress In Electromagnetics Research C, 89, 13-26, 2019/01, SCI
"Applying Strain Gauges to Measuring Thermal Warpage of Printed Circuit Boards", Measurement, 110, 239-248, 2017/11, SCI
"Applying Monte Carlo Simulation to Analyze the Open Scenario in the Assembly of Electronic Components", Transactions on Components, Packaging and Manufacturing Technology, 7, 11, 1911-1919, 2017/08, SCI
"Improve Electromagnetic Interference of Electronic Products with Taguchi Parametric Design", Measurement, 102, 200-207, 2017/05, SCI
"Improve Electromagnetic Compatibility of Electronic Products with Multivariate Parametric Design—a Case with Panel PC", Microelectronics International, 34, 1, 45-59, 2017/01, SCI
"Dynamic Parametric Design and Feasibility Assessment for a High Resistance Measuring System", Measurement, 92, 42-49, 2016/10, SCI
"A grey-ANN approach for optimizing the QFN component assembly process for smart phone application", Soldering & Surface Mount Technology, 28, 2, 63-73, 2016/02, SCI
"An innovative bamboo film inspired by workout and Triz", Journal of Industrial and Production Engineering, 2015/02, EI
"Developing a rework process for underfilled electronics components via integration of TRIZ and cluster analysis", IEEE Transactions on Components, Packaging and Manufacturing Technology, 5, 3, 422-438, 2015/02, SCI
"Innovative parametric design for environmentally conscious adhesive dispensing process", Journal of Intelligent Manufacturing, 26, 1, 1-12, 2015/02, SCI
"The synergy of QFD and TRIZ for solving EMC problems in electrical products-A case study for the Notebook PC", Journal of Industrial and Production Engineering, 2015/01, EI
"A study on introducing supplier process capacity database into tolerance design", Journal of Industrial and Production Engineering, 2014/10, EI
"Process optimization of SnCuNi soldering material using artificial parametric design", Journal of Intelligent Manufacturing, 25, 4, 813-823, 2014/08, SCI
"Parametric design of the adhesive dispensing process with multiple quality characteristics", Journal of Quality, 21, 4, 233-245, 2014/08, EI
"DOM Products: Activation Energy Estimation and Reliability Assessment", Applied Mechanics and Materials, 470, 781-784, 2014/01, EI
"Applying CHAID algorithm to investigate critical attributes of void formation in QFN assembly", Soldering and Surface Mount Technology, 25, 2, 117-127, 2013/12, SCI
"Package-on-package assembly yield assessment in the ODM/EMS environment using Monte Carlo simulation", IEEE Transactions on Components, Packaging and Manufacturing Technology, 3, 9, 1611-1620, 2013/09, SCI
"Process optimization of SnCuNi soldering material using artificial parametric design", Journal of Intelligent Manufacturing, 2013/07, SCI
"A breakthrough product R&D model by using the integration of four-phase QFDs and TRIZ", International Journal of Modelling, Identification and Control, 18, 3, 199-210, 2013/03, EI
"Innovative parametric design for environmentally conscious adhesive dispensing process", Journal of Intelligent Manufacturing, 2013/02, SCI
"Reliability assessment of RFID reader through prognostics and health management", Microelectronics Reliability, Vol. 53, pp. 136-144, 2013/01, SCI
"Intelligent Parametric Design for a Robust LED Encapsulation Process", IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 2, No 11, pp. 1919-1927, 2012/11, SCI
"Minimizing total flow time in permutation flowshop environment", International Journal of Innovative Computing, Information and Control, 8, 8, 1-14, 2012/08, SCI
"Innovative Design Process for Intelligent Patient Bed by Using Synergy TRIZ and QFDs", Advanced Materials Research, 538-541, 2901-2922, 2012/06, EI
"Sn–Cu–Ni Soldering Process Optimization Using Multivariate Analysis", IEEE Transactions on Components, Packaging and Manufacturing Technology, 2, 3, 527-535, 2012/03, SCI
"An innovative design for high performance control valve by using the synergy of QFD and TRIZ methods", Advanced Materials Research, 468-471, 339-354, 2012/02, EI
"The solder paste printing process: critical parameters, defect scenarios, specifications, and cost reduction", Soldering & Surface Mount Technology, 23, 4, 211-223, 2012/01, SCI
"Comparison of results from empirical ALT test to CAE simulation for wireless clients", Microelectronics International, 28, 3, 51-59, 2012/01, SCI
"Integration of Four-phase QFD and TRIZ in Product R&D – A Notebook Case Study", Research in Engineering Design, 22, 3, 125-141, 2011/06, SCI
"Reducing Solder Paste Inspection in Surface Mount Assembly through Mahalanobis-Taguchi Analysis", IEEE Transactions on Electronics Packaging Manufacturing, 33, 4, 265-274, 2010/10, SCI
"A Wavelet-Based Approach in Detecting Visual Defects on Semiconductor Wafer Dies", IEEE Transactions on Semiconductor Manufacturing, 23, 2, 284-292, 2010/05, SCI&EI
"Chemical Characterization of Failures And Process Materials for Microelectronics Assembly", Microelectronics International, 26, 3, 41~48, 2009/08, SCI&EI
"Sequencing Single-machine Tardiness Problems with Sequence Dependent Setup Times Using an Iterated Greedy heuristic", Expert Systems With Applications – ESWA, Vol.44, 2, 6, 2008/08, SCI&EI
"Establishing a High-Quality Closed-Loop System by Implementing a Digital Twin of the SMT Process", he 14th International Conference & Global Competition on Systematic Innovation, Guangdong, 2023/10/13
"Improving Customer Satisfaction for Green Packaging Using Kano Model", The 13th International Conference & Global Competition on Systematic Innovation, Hsinchu, 2022/10/15
"Identifying Key Factors for Selection of Retirement Planning Services: an AHP approach", The 12th International Conference & Global Competition on Systematic Innovation, Foshan University, 2021/10/15
"Improving Automotive Aftermarket Industry Online Channels by Integrated SERVQUAL and Kano Model into QFD", The 12th International Conference & Global Competition on Systematic Innovation, Foshan University, 2021/10/15
"Influences of Food Ordering and Delivery Service Mobile Applications on Restaurant Management - Examples of Small and Medium-Sized Restaurants in Bangkok", The 11th International Conference on Systematic Innovation, Taipei, 2020/10/23
"AutoML Invoice Error Search Tool for Taxations", The 11th International Conference on Systematic Innovation, Taipei, 2020/10/23
"The Entry Mode for Taiwan Enterprises Investment in Vietnam-A Case Study of Smart Switchgear Industry", The 11th International Conference on Systematic Innovation, Taipei, 2020/10/23
"A Machine Learning Based Framework for Exchange Rate Prediction through an Application of Principal Component Analysis", The 11th International Conference on Systematic Innovation, Taipei, 2020/10/23
"Using AHP Model to Determine Key Factors Affecting Tourist’s Satisfaction toward the North of Vietnam", The 11th International Conference on Systematic Innovation, Taipei, 2020/10/23
"Investigating Thai Gen Y Consumer Behavior towards Buying Electronic Products Online", The 11th International Conference on Systematic Innovation, Taipei, 2020/10/23
"Failed Component Image Acquisition Quality Optimization For Machine Vision System", International Conference on Science and Innovative Engineering, Kyoto, 2020/01/28
"Intelligent Failure Analysis for Electronics Device Using Red Ink Dye Stain Testing", ICSEM 2019: 4th International Conference on Smart Engineering Materials, Auckland, New Zealand, Auckland, 2019/03/09
"Application of TRIZ Theory to Solving Problems in Product Research and Development - Case Study of Probe Card Tester", ICCAIRO 2017: International Conference on Control, Prague, 2017/05/20
"Encapsulation Process Study and Yield Model for Smart Phone Manufacturing", Asia Pacific Industrial Engineering And Management Conference-APIEM, 台北, 2016/12/07
"ntegration of Kano Model and QFD for Service Quality Improvement", Business and Social Sciences Research Conference, London, 2016/04/11
"Lifetime Assessment of Cloud Service Products Based on RMA Data – Taking KVM Switch as an Example", 11th Annual International Conference on Information Technology & Computer Science, 雅典, 2015/05/18
"An Integrated Approach of Kano Model, Importance-Performance Analysis and TRIZ Inventive Principles for Improving the Education Quality", 2014 ISTS Asian Conference, 台北, 2014/11/17
"Systematic Innovations for Optimization of Distribution Center Operations – Example of Russian Post", 2014 ISTS Asian Conference, 台北, 2014/11/11
"DOM Products: Activation Energy Estimation and Reliability Assessment", 2013 the 2nd International Conference on Mechanical Engineering, Materials Science and Civil Engineering, Beijing, 2013/10/25
"The parametric design of adhesive dispensing process with multiple quality characteristics", 2013 IIE Asian Conference, 台北, 2013/07/18
"Systematic innovation for the retention and development of human talent", The 4th International Conference on Systematic Innovation & 5th CAD conference, 新竹, 2013/06/27
"Applying TRIZ methodology to innovate the current bicycle parking system", 2013系統性創新研討會暨第五屆中華系統性創新學會年, 桃園, 2013/01/05
"Re-designing a green vehicle using nanotech based on TRIZ/AD methodology", 3rd International conference on Urban Sustainability, Cultural Sustainability, Green Development, Green Structures and Clean Cars (USCUDAR '12), Barcelona, 2012/10/17
"Rework process development for an encapsulated device through the TRIZ approach", The 3rd International Conference on Systematic Innovation (ICSI), Seoul, 2012/07/09
"Innovative design process for intelligent patient bed by using synergy of TRIZ and QFDs methods", International Conference on Advanced Engineering Materials and Technology (AEMT), Zhuahi, 2012/07/06
"An innovative design for high performance control valve by using the synergy of QFD and TRIZ methods", International Conference on Manufacturing Science and Engineering (ICMSE), Xiamen, 2012/03/27
"The Characterization and Simulation of Reflow Temperature Profile", The 12th Electronic Circuits World Convention (ECWC), 台北, 2012/01/01
"A Breakthrough Product R&D Process by Using Four-phase QFDs and TRIZ Integration", International Conference on Modelling, identification and Control, Shanghai, 2011/06/26
"Using the Monte Carlo Simulation to predict the Assembly Yield", International Conference on Manufacturing Systems Engineering, 曼谷, 2011/03/29
"以蒙地卡羅模擬評估型 I 設限預測模型並評估保固風險-以DOM產品為例", 2010 CIIE工業工程與管理年會暨學術研討會, 台南, 2010/12/25
"Stencil Evaluation of Ultra Fine Pitch Solder Paste Printing Process", The 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, 台北, 2010/10/22
"Failure Analysis of ENIG Surface Finish Pad", The 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, 台北, 2010/10/22
"Reliability Assessment of the PoP Lead Free Solder Joint through Temperature Cycling Test", The 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, 台北, 2010/10/22
"The Evaluation of Assembly Process for Package on Package Components", The 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, 2009/10/21
"Reliability Assessment for Printed Circuit Board In Lead-Free Process", The InterPACK 2009 International Conference, San Francisco, 2009/07/19
"Investigate the Performance of SnCuNi Alloy for Wave Soldering", The 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, 2008/10/22
"The Optimization of Reflow Soldering Process for Lead Free Materials", The 36th International Conference on Computers and Industrial Engineering, 台北, 2006/06/20
"Assembly Line Balancing of PCB Dual In-Line Packaging Line", Sixth Asia-Pacific Industrial Engineering and Management Systems Conference （2005 APIEMS）, Manila, 2005/12/01
"The Use of SLP and Paired Exchange Methods for Facility Layout in The Notebook Computer Production Plant", Fifth Asia-Pacific Industrial Engineering and Management Systems Conference （2004 APIEMS）, Gold Coast, 2004/12/12
"Study of Process Capability for The Stencil Printing in PCB Assembly", Fifth Asia-Pacific Industrial Engineering and Management Systems Conference （2004 APIEMS）, Gold Coast, 2004/12/12
"The Reliability Test Plan for The Disk on Module", The fourth Asia-Pacific Conference on Industrial Engineering and Management Systems, 台北, 2002/12/18
