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國立臺北科技大學 學術資源網

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黃乾怡教授Jay Huang

現職:
臺北科大/工業工程與管理系
聯絡方式:

期刊論文

  • "Enhancing Sustainability in Belize’s Ecotourism Sector: A Fuzzy Delphi and Fuzzy DEMATEL Investigation of Key Indicators", Mathematics, 11, 13, 2816, 2023/06, SCI
  • "Neutrosophic Autocratic Multi-Attribute Decision-Making Strategies for Building Material Supplier Selection.", Buildings, 13, 6, 1373, 2023/05, SCI
  • "Bitcoin volatility forecasting: An artificial differential equation neural network.", AIMS Mathematics, 8, 6, 13907-13922, 2023/04, SCI
  • "Bitcoin volatility forecasting: An artificial differential equation neural network.", AIMS Mathematics, 8, 6, 13907-13922, 2023/04, SCI
  • "A Novel Approach to Service Design within the Tourism Industry: Creating a Travel Package with AHP-TRIZ Integration", Systems, 11, 4, 178, 2023/03, SCI
  • "An optimized method for solving membership-based neutrosophic linear programming problems.", Studies in Informatics and Control, 31, 4, 45-52, 2023/01, SCI
  • "An optimized model for neutrosophic multi-choice goal programming", Miskolc Mathematical Notes, 24, 2, 915-931, 2023/01, SCI
  • "A Novel CSAHP Approach to Assess the Priority of Maintenance Work Outsourced by a Metro Company", Processes, 11, 1, 100, 2023/01, SCI
  • "5G Digital Twin: A Study of Enabling Technologies", Applied Sciences, 12, 15, 7794, 2022/08, SCI
  • "A Lean Manufacturing Progress Model and Implementation for SMEs in the Metal Products Industry", Processes, 10, 5, 835, 2022/04, SCI
  • "Applying Deep Learning to Construct a Defect Detection System for Ceramic Substrates", Applied Sciences, 12, 5, 2269, 2022/02, SCI
  • "Applying Taguchi Method to Optimize Vacuum Printing Encapsulation Process", IEEE Transactions on Components, Packaging and Manufacturing Technology, 12, 1, 185-191, 2022/01, SCI
  • "Evaluating the Sustainable Operating Performance of Electronics Industry Groups: Taiwanese Firms in Mainland China", Sustainability, 13, 21, 2021/11, SCI
  • "Improving the electromagnetic compatibility of electronic products by using response surface methodology and artificial neural network", Microelectronics International, 2021/09, SCI
  • "Design criteria for pad and stencil with high pick-and-Place yield", Soldering & Surface Mount Technology, 2021/09, SCI
  • "A Practice of BLE RSSI Measurement for Indoor Positioning", Sensors, 21, 15, 2021/07, ELSE2
  • "Parameter Optimization of Pretin Printing Process of Wireless Communication Module", IEEE Transactions on Components, Packaging and Manufacturing Technology, 11, 7, 1137-1147, 2021/07, SCI
  • "A machine learning-based framework for exchange rate analysis and prediction", International Journal of Research Publications, 74, 1, 2021/04, ELSE2
  • "Application of multi-quality parameter design in the optimization of underfilling process", Soldering & Surface Mount Technology, DOI: 10.1108/SSMT-05, DOI: 10.1108/SSMT-05, DOI: 10.1108/SSMT-05, 2020/09, SCI
  • "Failed Component Image Acquisition Quality Optimization For Machine Vision System", Journal of Current Trends in Signal Processing, 10, 2, 17-25, 2020/01, ELSE2
  • "Intelligent parametric design for a multiple-quality-characteristic glue-dispensing process", Journal of Intelligent Manufacturing, 30, 5, 2291-2305, 2019/06, SCI
  • "A digital image processing model for characteristics capture and analysis of irregular electronic components", The International Journal of Advanced Manufacturing Technology, 102, 9-12, 4309-4318, 2019/06, SCI
  • "Using Parametric Design to Reduce the EMI of Electronics Products — Example of Medical-Grade Touch Panel Computer", Progress In Electromagnetics Research C, 89, 13-26, 2019/01, SCI
  • "Applying Strain Gauges to Measuring Thermal Warpage of Printed Circuit Boards", Measurement, 110, 239-248, 2017/11, SCI
  • "Applying Monte Carlo Simulation to Analyze the Open Scenario in the Assembly of Electronic Components", Transactions on Components, Packaging and Manufacturing Technology, 7, 11, 1911-1919, 2017/08, SCI
  • "Improve Electromagnetic Interference of Electronic Products with Taguchi Parametric Design", Measurement, 102, 200-207, 2017/05, SCI
  • "Improve Electromagnetic Compatibility of Electronic Products with Multivariate Parametric Design—a Case with Panel PC", Microelectronics International, 34, 1, 45-59, 2017/01, SCI
  • "Dynamic Parametric Design and Feasibility Assessment for a High Resistance Measuring System", Measurement, 92, 42-49, 2016/10, SCI
  • "A grey-ANN approach for optimizing the QFN component assembly process for smart phone application", Soldering & Surface Mount Technology, 28, 2, 63-73, 2016/02, SCI
  • "An innovative bamboo film inspired by workout and Triz", Journal of Industrial and Production Engineering, 2015/02, EI
  • "Innovative parametric design for environmentally conscious adhesive dispensing process", Journal of Intelligent Manufacturing, 26, 1, 1-12, 2015/02, SCI
  • "Developing a rework process for underfilled electronics components via integration of TRIZ and cluster analysis", IEEE Transactions on Components, Packaging and Manufacturing Technology, 5, 3, 422-438, 2015/02, SCI
  • "The synergy of QFD and TRIZ for solving EMC problems in electrical products-A case study for the Notebook PC", Journal of Industrial and Production Engineering, 2015/01, EI
  • "A study on introducing supplier process capacity database into tolerance design", Journal of Industrial and Production Engineering, 2014/10, EI
  • "Parametric design of the adhesive dispensing process with multiple quality characteristics", Journal of Quality, 21, 4, 233-245, 2014/08, EI
  • "Process optimization of SnCuNi soldering material using artificial parametric design", Journal of Intelligent Manufacturing, 25, 4, 813-823, 2014/08, SCI
  • "DOM Products: Activation Energy Estimation and Reliability Assessment", Applied Mechanics and Materials, 470, 781-784, 2014/01, EI
  • "Applying CHAID algorithm to investigate critical attributes of void formation in QFN assembly", Soldering and Surface Mount Technology, 25, 2, 117-127, 2013/12, SCI
  • "Package-on-package assembly yield assessment in the ODM/EMS environment using Monte Carlo simulation", IEEE Transactions on Components, Packaging and Manufacturing Technology, 3, 9, 1611-1620, 2013/09, SCI
  • "Process optimization of SnCuNi soldering material using artificial parametric design", Journal of Intelligent Manufacturing, 2013/07, SCI
  • "A breakthrough product R&D model by using the integration of four-phase QFDs and TRIZ", International Journal of Modelling, Identification and Control, 18, 3, 199-210, 2013/03, EI
  • "Innovative parametric design for environmentally conscious adhesive dispensing process", Journal of Intelligent Manufacturing, 2013/02, SCI
  • "Reliability assessment of RFID reader through prognostics and health management", Microelectronics Reliability, Vol. 53, pp. 136-144, 2013/01, SCI
  • "Intelligent Parametric Design for a Robust LED Encapsulation Process", IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 2, No 11, pp. 1919-1927, 2012/11, SCI
  • "Minimizing total flow time in permutation flowshop environment", International Journal of Innovative Computing, Information and Control, 8, 8, 1-14, 2012/08, SCI
  • "Innovative Design Process for Intelligent Patient Bed by Using Synergy TRIZ and QFDs", Advanced Materials Research, 538-541, 2901-2922, 2012/06, EI
  • "Sn–Cu–Ni Soldering Process Optimization Using Multivariate Analysis", IEEE Transactions on Components, Packaging and Manufacturing Technology, 2, 3, 527-535, 2012/03, SCI
  • "An innovative design for high performance control valve by using the synergy of QFD and TRIZ methods", Advanced Materials Research, 468-471, 339-354, 2012/02, EI
  • "The solder paste printing process: critical parameters, defect scenarios, specifications, and cost reduction", Soldering & Surface Mount Technology, 23, 4, 211-223, 2012/01, SCI
  • "Comparison of results from empirical ALT test to CAE simulation for wireless clients", Microelectronics International, 28, 3, 51-59, 2012/01, SCI
  • "Integration of Four-phase QFD and TRIZ in Product R&D – A Notebook Case Study", Research in Engineering Design, 22, 3, 125-141, 2011/06, SCI
  • "Reducing Solder Paste Inspection in Surface Mount Assembly through Mahalanobis-Taguchi Analysis", IEEE Transactions on Electronics Packaging Manufacturing, 33, 4, 265-274, 2010/10, SCI
  • "A Wavelet-Based Approach in Detecting Visual Defects on Semiconductor Wafer Dies", IEEE Transactions on Semiconductor Manufacturing, 23, 2, 284-292, 2010/05, SCI&EI
  • "Chemical Characterization of Failures And Process Materials for Microelectronics Assembly", Microelectronics International, 26, 3, 41~48, 2009/08, SCI&EI
  • "應用資料包絡分析法(DEA)於六標準差專案之績效評估", 技術學刊, 24, 2, 117~130, 2009/06, ELSE1
  • "Sequencing Single-machine Tardiness Problems with Sequence Dependent Setup Times Using an Iterated Greedy heuristic", Expert Systems With Applications – ESWA, Vol.44, 2, 6, 2008/08, SCI&EI
  • "無鉛製程電路板材料之發展與應用", 電子月刊-11月專輯封裝技術, 第十三卷, 第11期, PP.139-151, 2007/11, ELSE1
  • "田口方法應用於無鉛迴銲製程參數優化", 科學與工程技術期刊, 第3卷, 第2期, 9, 2006/09, ELSE1
  • "無鉛環保銲料鋼板印刷製程參數優化", 技術學刊, 第21卷, 第3期, PP.227-236, 2006/09, ELSE1
  • "無針腳型CSP元件組裝製程與可靠度分析", 電子與材料, 工業技術研究院工業材, 第24期, pp.98-103, 2004/11, ELSE1
  • "IC元件X、Y平面及Z方向置放良率分析", 中國工業工程學會學刊, 第21卷, 第4期, pp.339-348, 2004/07, ELSE1
  • "The Reliability Assessment of Flip Chip Component", Microelectronics International, Vol.21, No2, pp.10-15, 2004/01, SCI&EI
  • "以實驗設計改善筆記型電腦PCB設計與組裝", 中國工業工程學會學刊, 第19卷, 第6期, PP.22-32, 2002/11, ELSE1
  • "The Investigation of The Capillary Flow of Underfill Materials", Microelectronics International, Vol.19, No1, pp.23-29, 2002/01, SCI&EI

專書著作

  • Quality Control, InTech - Open Access, Austria, European Union, 978-953-307-329-3, 2011/07/01

專章著作

  • Chapter: Materials Assessment and Process Characterization for Lead-Free Soldering, 1, InTech - Open Access, 978-953-51-1140-5, 2013/06/01

研討會論文

  • "基於深度學習之回焊爐預測性維護", 2023中國工業工程學會年會暨學術研討會, 台中, 2023/12/09
  • "Establishing a High-Quality Closed-Loop System by Implementing a Digital Twin of the SMT Process", he 14th International Conference & Global Competition on Systematic Innovation, Guangdong, 2023/10/13
  • "整合田口品質損失與主成份分析方法應用於3D列印技術-以置件機台機構零件為例", 2023-系統性創新研討會與專案競賽, 台南, 2023/01/14
  • "Improving Customer Satisfaction for Green Packaging Using Kano Model", The 13th International Conference & Global Competition on Systematic Innovation, Hsinchu, 2022/10/15
  • "Identifying Key Factors for Selection of Retirement Planning Services: an AHP approach", The 12th International Conference & Global Competition on Systematic Innovation, Foshan University, 2021/10/15
  • "Improving Automotive Aftermarket Industry Online Channels by Integrated SERVQUAL and Kano Model into QFD", The 12th International Conference & Global Competition on Systematic Innovation, Foshan University, 2021/10/15
  • "Influences of Food Ordering and Delivery Service Mobile Applications on Restaurant Management - Examples of Small and Medium-Sized Restaurants in Bangkok", The 11th International Conference on Systematic Innovation, Taipei, 2020/10/23
  • "AutoML Invoice Error Search Tool for Taxations", The 11th International Conference on Systematic Innovation, Taipei, 2020/10/23
  • "The Entry Mode for Taiwan Enterprises Investment in Vietnam-A Case Study of Smart Switchgear Industry", The 11th International Conference on Systematic Innovation, Taipei, 2020/10/23
  • "A Machine Learning Based Framework for Exchange Rate Prediction through an Application of Principal Component Analysis", The 11th International Conference on Systematic Innovation, Taipei, 2020/10/23
  • "Using AHP Model to Determine Key Factors Affecting Tourist’s Satisfaction toward the North of Vietnam", The 11th International Conference on Systematic Innovation, Taipei, 2020/10/23
  • "Investigating Thai Gen Y Consumer Behavior towards Buying Electronic Products Online", The 11th International Conference on Systematic Innovation, Taipei, 2020/10/23
  • "Failed Component Image Acquisition Quality Optimization For Machine Vision System", International Conference on Science and Innovative Engineering, Kyoto, 2020/01/28
  • "Intelligent Failure Analysis for Electronics Device Using Red Ink Dye Stain Testing", ICSEM 2019: 4th International Conference on Smart Engineering Materials, Auckland, New Zealand, Auckland, 2019/03/09
  • "Application of TRIZ Theory to Solving Problems in Product Research and Development - Case Study of Probe Card Tester", ICCAIRO 2017: International Conference on Control, Prague, 2017/05/20
  • "Encapsulation Process Study and Yield Model for Smart Phone Manufacturing", Asia Pacific Industrial Engineering And Management Conference-APIEM, 台北, 2016/12/07
  • "ntegration of Kano Model and QFD for Service Quality Improvement", Business and Social Sciences Research Conference, London, 2016/04/11
  • "Lifetime Assessment of Cloud Service Products Based on RMA Data – Taking KVM Switch as an Example", 11th Annual International Conference on Information Technology & Computer Science, 雅典, 2015/05/18
  • "運用TRIZ於電子元件重工製程研發", 2015年系統性創新研討會, 台北, 2015/01/17
  • "整合TRIZ發明原則與演化趨勢於產品研發之問題解決-以電子防潮櫃為例", 2015年系統性創新研討會, 台北, 2015/01/07
  • "An Integrated Approach of Kano Model, Importance-Performance Analysis and TRIZ Inventive Principles for Improving the Education Quality", 2014 ISTS Asian Conference, 台北, 2014/11/17
  • "Systematic Innovations for Optimization of Distribution Center Operations – Example of Russian Post", 2014 ISTS Asian Conference, 台北, 2014/11/11
  • "DOM Products: Activation Energy Estimation and Reliability Assessment", 2013 the 2nd International Conference on Mechanical Engineering, Materials Science and Civil Engineering, Beijing, 2013/10/25
  • "The parametric design of adhesive dispensing process with multiple quality characteristics", 2013 IIE Asian Conference, 台北, 2013/07/18
  • "Systematic innovation for the retention and development of human talent", The 4th International Conference on Systematic Innovation & 5th CAD conference, 新竹, 2013/06/27
  • "Applying TRIZ methodology to innovate the current bicycle parking system", 2013系統性創新研討會暨第五屆中華系統性創新學會年, 桃園, 2013/01/05
  • "Re-designing a green vehicle using nanotech based on TRIZ/AD methodology", 3rd International conference on Urban Sustainability, Cultural Sustainability, Green Development, Green Structures and Clean Cars (USCUDAR '12), Barcelona, 2012/10/17
  • "Rework process development for an encapsulated device through the TRIZ approach", The 3rd International Conference on Systematic Innovation (ICSI), Seoul, 2012/07/09
  • "Innovative design process for intelligent patient bed by using synergy of TRIZ and QFDs methods", International Conference on Advanced Engineering Materials and Technology (AEMT), Zhuahi, 2012/07/06
  • "環保點膠製程研發與創新參數設計", 第五屆管理知識與技術提升學術與實務研討會, 台北, 2012/05/03
  • "An innovative design for high performance control valve by using the synergy of QFD and TRIZ methods", International Conference on Manufacturing Science and Engineering (ICMSE), Xiamen, 2012/03/27
  • "應用TRIZ方法改善點膠製程中剩餘膠量之檢測及警訊", 大中華系統性創新研討會暨第四屆中華系統性創新學會年會, 高雄, 2012/01/07
  • "塑膠封裝材料之黏度模型建立及製程參數設計", 2011第十二屆科技與管理學術研討會, 台北, 2012/01/01
  • "RFID讀取器於高溫試驗與正常使用條件下之可靠度分析", 中華民國品質學會第四十七屆年會暨2011國際品質管理研討會, 彰化, 2012/01/01
  • "The Characterization and Simulation of Reflow Temperature Profile", The 12th Electronic Circuits World Convention (ECWC), 台北, 2012/01/01
  • "A Breakthrough Product R&D Process by Using Four-phase QFDs and TRIZ Integration", International Conference on Modelling, identification and Control, Shanghai, 2011/06/26
  • "Using the Monte Carlo Simulation to predict the Assembly Yield", International Conference on Manufacturing Systems Engineering, 曼谷, 2011/03/29
  • "以蒙地卡羅模擬評估型 I 設限預測模型並評估保固風險-以DOM產品為例", 2010 CIIE工業工程與管理年會暨學術研討會, 台南, 2010/12/25
  • "Stencil Evaluation of Ultra Fine Pitch Solder Paste Printing Process", The 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, 台北, 2010/10/22
  • "Failure Analysis of ENIG Surface Finish Pad", The 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, 台北, 2010/10/22
  • "Reliability Assessment of the PoP Lead Free Solder Joint through Temperature Cycling Test", The 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, 台北, 2010/10/22
  • "錫銅鎳環保銲料電子組裝製程分析", 2010年「環境與能源論壇」研討會, 上海, 2010/07/12
  • "應用智慧型參數設計法於錫膏印刷製程參數優化", 第十七屆模糊理論及其應用會議, 高雄市, 2009/12/18
  • "The Evaluation of Assembly Process for Package on Package Components", The 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, 2009/10/21
  • "Reliability Assessment for Printed Circuit Board In Lead-Free Process", The InterPACK 2009 International Conference, San Francisco, 2009/07/19
  • "應用資料包絡分析法(DEA)於六標準差專案之績效評估", 技術學刊, 高雄, 2009/06/01
  • "Investigate the Performance of SnCuNi Alloy for Wave Soldering", The 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, 2008/10/22
  • "運用同步工程改善新產品專案開發作業流程以Battery Pack 為例", 2008永續性產品與產業管理研討會, 台北, 2008/03/08
  • "The Study of Mini-wave Soldering Process in Lead Free Assembly", SMTA Conference in Shanghai in conjunction with NEPCON China, 上海, 2007/04/22
  • "運用實驗設計方法改善石英振盪器封裝製程之噴濺現象", 第五屆精密製造學術研討會, 高雄, 2006/11/11
  • "運用同步工程改善新產品專案開發作業流程以Battery Pack為例", 中華民國品質學會第四十二屆年會暨第十二屆全國品質管理研討會, 台中, 2006/11/04
  • "0603被動元件推力試驗之再現性與再生性分析", 中華民國品質學會第四十二屆年會暨第十二屆全國品質管理研討會, 台中, 2006/11/04
  • "DOM產品可靠度試驗", 中華民國品質學會第四十二屆年會暨第十二屆全國品質管理研討會, 台中, 2006/11/04
  • "The Optimization of Reflow Soldering Process for Lead Free Materials", The 36th International Conference on Computers and Industrial Engineering, 台北, 2006/06/20
  • "Assembly Line Balancing of PCB Dual In-Line Packaging Line", Sixth Asia-Pacific Industrial Engineering and Management Systems Conference (2005 APIEMS), Manila, 2005/12/01
  • "The Use of SLP and Paired Exchange Methods for Facility Layout in The Notebook Computer Production Plant", Fifth Asia-Pacific Industrial Engineering and Management Systems Conference (2004 APIEMS), Gold Coast, 2004/12/12
  • "Study of Process Capability for The Stencil Printing in PCB Assembly", Fifth Asia-Pacific Industrial Engineering and Management Systems Conference (2004 APIEMS), Gold Coast, 2004/12/12
  • "底填封膠製程參數優化研究", 中華民國品質學會第四十屆年會暨第十屆全國品質管理研討會, 高雄, 2004/11/06
  • "運用美國商規Bellcore評估電子產品可靠度-以數位相機為例", 中華民國品質學會第四十屆年會暨第十屆全國品質管理研討會, 高雄, 2004/11/06
  • "運用SLP與成對交換法於筆記型電腦生產設施佈置", 管理知識與技術提升研討會, 台北, 2004/05/28
  • "運用模糊理論建構電子產品之FMEA評點系統", 第二十屆機械工程研討會, 台北, 2003/12/05
  • "筆記型電腦試產流程規劃暨量產分析", SME國際製造工程學會第三屆精密機械製造研討會, 高雄, 2003/11/15
  • "鋼板印刷製程能力分析", 第九屆全國品質管理研討會, 桃園, 2003/11/08
  • "The Reliability Test Plan for The Disk on Module", The fourth Asia-Pacific Conference on Industrial Engineering and Management Systems, 台北, 2002/12/18
  • "DOM產品可靠度試驗計劃之研究", 中國機械工程學會第十九屆全國學術研討會, 雲林, 2002/11/29
  • "利用Relex軟體預估電子產品可靠度-以DOM為例", 中華民國品質學會第三十八屆年會暨第八屆全國品質管理研究會, 台中, 2002/11/01
  • "CF卡生產流程瓶頸分析", 2002年科技與管理學術研討會-e時代的製造整合與協同管理, 台北, 2002/10/18
  • "PCB手擺件之工作指派研究", 2002PCB製造與管理技術研討會, 桃園, 2002/06/22
  • "無鉛銲料特性評估與製程分析", 2002 PCB製造與管理技術研討會, 桃園, 2002/06/22

相關證照

  • 萃智(TRIZ)創新士種子講師認證研習證書, 國立虎尾科技大學
  • 萃智創新士講師證書, 中華民國系統性創新學會
  • MATRIZ Level 2, The International TRIZ Association
  • MATRIZ Level 3, The International TRIZ Association
  • MATRIZ Level 1, The International TRIZ Association
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