"Electrochemical Characteristics of Nickel Hydroxide Fabricated from a Spent Electroless Plating Bath", International Journal of ELECTROCHEMICAL SCIENCE, 17, 1, 22026, 2022/01, SCI
"Removal of nickel from chemical plating waste solution through precipitation and production of microsized nickel hydroxide particles", Separation and Purification Technology, 251, 15, 117315, 2020/11, SCI
"Bulk Si production from Si–Fe melts under temperature gradients, part I: Growth and characterization.", Journal of Materials Research and Technology, 9, 6, 12595– 12603, 2020/09, SCI
"Some Aspects of Mechanism of Electropolishing of Copper in Phosphoric Acid", International Journal of ELECTROCHEMICAL SCIENCE, 14, 12, 11035 – 11047, 2019/12, SCI
"Recovery of Submicron-Sized Silicon-Rich Powder from Silicon Sawing Waste for Electrocatalyst of Methanol Electrooxidation", International Journal of ELECTROCHEMICAL SCIENCE, 13, 6880 – 6896, 2018/07, SCI
"Recovery of polyalkylene glycol from silicon cutting waste using centrifugation", Desalination and Water Treatment, 56, 10, 443–451, 2015/10, SCI
"Recovery of polyalkylene glycol from silicon cutting waste using centrifugation", Desalination and Water Treatment, 2014/07, SCI
"Recovering low-turbidity cutting liquid from silicon slurry waste", Journal of Hazardous Materials, 271, 4, 252–257, 2014/04, SCI
"Recovery of indium from etching waste using a rotating cylinder electrode system", Fresenius Environmental Bulletin, 23, 1, 1-6, 2014/01, SCI
"Recycling Silicon Wiresaw Slurries: Separation of Silicon and Silicon Carbide in a Ramp Settling Tank under an Applied Electrical Field", Journal of the Air & Waste Management Association, 63, 5, 521-527, 2013/02, SCI
"Silicon sawing waste treatment by electrophoresis and gravitational settling", Journal of Hazardous Materials, 189, 1-2, 526-530, 2011/05, SCI
"Modified sedimentation system for improving separation of silicon and silicon carbide in recycling of sawing waste", Separation and Purification Technology, 78, 1, 16-20, 2011/03, SCI
"Electrochemical investigations for copper electrodeposition of through-silicon via", Microelectronic Engineering, 88, 2, 195-199, 2011/02, SCI
"Removal of metal impurities from cutting slurry waste using a modified electrokinetic system", Fresenius Environmental Bulletin, 20, 1, 99-103, 2011/01, SCI
"Iron Removal during Recovery of Silicon from Sawing Waste by Applying Magnetic Field", Separation Science and Technology, 46, 5, 702 - 707, 2011/01, SCI
"Copper electrodeposition in a through-silicon via evaluated by rotating disc electrode techniques", Journal of Micromechanics and Microengineering, 20, 11, 115023, 2010/11, SCI
"Acetic acid and phosphoric acid adding to improve tantalum chemical mechanical polishing in hydrogen peroxide-based slurry", Microelectronic Engineering, 87, 2, 174-179, 2010/02, SCI
"Pretreatment of recycling wiresaw slurries—Iron removal using acid treatment and electrokinetic separation", Separation and Purification Technology, 68, 1, 24-29, 2009/06, SCI
"Metal Removal from Silicon Sawing Waste using the Electrokinetic Method", Journal of the Taiwan Institute of Chemical Engineers, 40, 1, 1-5, 2009/01, SCI
"Effect of Organic Acids on Copper Chemical Mechanical Polishing", Microelectronic Engineering, 84, 12, 2790-2798, 2007/12, SCI
"Adding Polyethylene Glycols to Enhance the Electrochemical Planarization of Copper-Plated Wafer", Northern Taiwan Journal, 29, 106-115, 2006/11, ELSE1
"Effects of Nonionic Surfactants on Performance of Copper Chemical Mechanical Polishing", Chemical Engineering Communications, 193, 6, 702-714, 2006/06, SCI
"Wet etching mechanisms of ITO films in oxalic acid", Microelectronic Engineering, 83, 3, 536-541, 2006/03, SCI
"Organic Acid Mixing to Improve ITO Film Etching in Flat Panel Display Manufacture", Journal of The Electrochemical Society, 153, 1, C86-C90, 2006/01, SCI
"Glycolic Acid in Hydrogen Peroxide-Based Slurry for Enhancing Copper Chemical Mechanical Polishing", Microelectronic Engineering, 77, 3-4, 193-203, 2005/04, SCI
"Effects of Added Surfactants on Chemical Mechanical Polishing in Nano-Alumina Slurries", Kung Wu Journal, 27, 93-103, 2004/11, ELSE1
"A Study of Copper Chemical Mechanical Polishing in Urea-Hydrogen Peroxide Slurry by Electrochemical Impedance Spectroscopy", Applied Surface Science, 214, 1-4, 120-135, 2003/05, SCI
"Localized Corrosion Effects and Modifications of Acidic and Alkaline Slurries on Copper Chemical Mechanical Polishing", Applied Surface Science, 210, 3-4, 190-205, 2003/04, SCI
研討會論文
"Effect of 1, 2, 4-triazole and glycine on galvanic corrosion of copper and molybdenum during chemical mechanical polishing", 2023 International Conference on Green Electrochemical Technologies (2023 ICGET-Tw), Taipei, 2023/10/26
"Analysis of an electrolyte imbalance in a vanadium redox flow battery by UV-Vis spectroscopy and potentiometric titration", 2023 International Conference on Green Electrochemical Technologies (2023 ICGET-Tw), Taipei, 2023/10/26
"Precipitation treatment of electroless nickel plating solution for producing TiO2/Ni(OH)2 photoelectrocatalyst", 2022Taipei International Conference on Catalysis (TICC), Taipei, 2022/07/20
"Enhancement of carbon-felt electrochemical activity for V(IV)/V(V) redox reaction", 2022Taipei International Conference on Catalysis (TICC), Taipei, 2022/07/20
"Preparation of TiO2 photoanode and its anticorrosion performance", 2022台灣陶瓷年會暨科技部專題研究計畫成果發表, 新北市, 2022/05/21
"Electrostatic separation for recycling silicon from the crushed photovoltaic modules", 7th International Symposium on Advanced Ceramics and Technology for Sustainable Energy Applications toward a Low Carbon Society, Taipei, 2021/11/15
"Production of lithium carbonate using injection of carbon dioxide into concentrated brine", 第38屆台灣觸媒及反應工程研討會,暨科技部專題研究計畫成果發表會, Taipei, 2020/07/16
"以電化學冶法將酸鉛還原為鉛", 中國礦冶工程學會年會, 台南, 2019/11/20
"Photoelectrochemical Properties of TiO2/Ni(OH)2 Composite Film on Corrosion Protection of 304 Stainless Steel", TACT2019 International Thin Films Conference, Taipei, 2019/11/17
"Cathodic protection on steel via photoelectrochemical effect of TiO2/In2O3 composite film", 2nd International Conference on Nanomaterials & Advanced Composites, Taipei, 2019/08/09
"Photoelectrochemical Anticorrosion by Using Indium Oxide and Titanium Dioxide", Global Conference on Engineering and Applied Science (GCEAS), TOKYO, 2018/07/10
"Photoelectrochemical Anticorrosion of a TiO2 Coating for Metal", 2017台灣化學工程學會64週年年會暨科技部化工學門成果發表會, 台北, 2017/11/17
"A study on bromine half-cell for redox flow batteries", 「台灣化學工程學會62周年年會暨科技部化工學門成果發表會」與「2015台韓日三國化工聯合會議」, 高雄, 2015/11/05
"Recovery of Nanosilver from Si-Wafer Manufacturing Wastes", 66th Annual Meeting of the International Society of Electrochemistry, Taipei, 2015/10/04
"Preparation of high-performance methanol electrooxidation catalysts with the recovered materials from silicon slurry waste", the 7th International Conference on Green and Sustainable Chemistry (GSC-7) and 4th JACI/GSC Symposium, Tokyo, 2015/07/05
"Electrochemical Surface Treatment of Indium Gallium Zinc Oxide Films", 2nd International Symposium on Anodizing Science and Technology (AST2014), Sapporo, 2014/06/04
"Separation of Metal Impurities from Silicon Sawing Waste", the 14th Asia Pacific Confederation of Chemical Engineering, Singapore, 2012/02/21
"Recycling Silicon from Sawing Waste by Sedimentation in Applied Electrical and Magnetic Fields", IUMRS-ICA 2011 12th International Conference in Asia, Taipei, 2012/01/19
"Electrochemical techniques for the study of high-aspect-ratio copper-electrodeposition", The 6th International Conference on MicroManufacturing (ICOMM), Tokyo, 2011/03/07
"Electropolishing of Indium Tin Oxide in Oxalic and Tartaric Acid", Active-Matrix Flatpanel Displays and Devices (AM-FPD 09), Nara, 2009/07/01
"Iron Removal from Silicon Wiresaw Slurries", 2008 Taiwan/Korea/Japan Chemical Engineering Conference and 55th Taiwan Institute of Chemical Engineers Annual Conference, Taipei, 2008/11/22
"Electropolishing Mechanisms of Copper-Plated Wafer in Phosphoric Acid", Chemical Engineering Annual Meeting, Tao-Yuan, 2007/11/22
"Electrochemical Planarization of Copper-Plated Wafer in Phosphoric Acid", The Electrochemical Society 211th Meeting, Chicago, 2007/05/01
"Electrochemical Impedance Spectroscopy of Copper during Electrochemical Polishing", Chemical Engineering Annual Meeting, Kaohsiung, 2006/11/22
"The Chemical Mechanical Polishing of Ta Barrier and Its Electrochemical Characteristics", Chemical Engineering Annual Meeting, Miaoli, 2005/11/22
"The Study on Planarizing Copper Thin Films by Electrochemical Polishing", Chemical Engineering Annual Meeting, Miaoli, 2005/11/22
"Electrochemical Action between Cu and Ta/TaN Barrier during CMP", Chemical Engineering Annual Meeting, Tainan, 2004/11/22
"Corrosion Action between Cu and Ta/TaN Barrier during CMP", The Electrochemical Society 206th Meeting, Hawaii, 2004/10/03
"Electrochemical Impedance Spectroscopy of Copper during Chemical Mechanical Polishing in Urea-H2O2 Slurries", Chemical Engineering Annual Meeting, Taipei, 2003/11/22
"Effects of Added Various Surfactants on the Properties of Alumina Slurries", 2003 Annual AICHE Meeting, San Francisco, 2003/11/10
