:::
W.T. Hsiao*, S.F. Tseng, K.C. Huang, D. Chiang, M.F. Chen, “Micro-hole machining of silicon wafer in air and under de-ionized water by a pulsed UV laser system”, Applied Physics A: Materials Science & Processing, 110(3), pp.565-570, 2013. (SCI)
回頁首
