:::
C.C. Yang, C.C. Yang, C.N. Hsu, K.C. Huang, S.F. Tseng, W.T. Hsiao*, “Multilayer stack materials on silicon-based wafer dicing processes using ultraviolet laser direct dicing and milling methods”, Optics and Laser Technology, 108, pp. 441-449, 2018. (SCI)
回頁首
